Electrostatic Clamping Solution for Glass and Dielectric Substrates

           BWGTC is pleased to introduce an electrostatic clamping solution for glass and dielectric substrates in a high vacuum processing chamber for deposition and etch processes.

·      This chuck plugs into a modified base assembly that accepts a Lam Research 718-092326-061 electrostatic chuck.

·      BWGTC has successfully clamped Corning 1373 and Eagle 2000 glass plates that are .7mm thick in a vacuum chamber.

·      The initial design is for a 6” major flat type substrate and these results are scalable for 100, 200, and 300mm clamping.  

·      The clamp can be redesigned to fit other manufacturers tool sets e.g. AMAT , Novellus, Mattson, and TEL to name a few.

·      The holding force results are applicable to other dielectric materials. In this case we have demonstrated clamping of a substrate with a dielectric constant > 5.  

Features:

·      Bipolar operation +/- 2000 VDC (4000 volts)

·      Fast clamp and release times

·      Backside gas can be introduced 3 seconds after full voltage is reached on the device (fast clamp)

·      Holding force is specified at > 20 Torr of backside pressure at 4000 volts. We do not recommend running the backside gas at 20 Torr.

·      Release of the substrate (dechucking) occurs within 3 seconds of the ESC voltage reaching 0 volts

·      The structure has successfully held a glass substrate with 20 Torr of backside gas pressure and a RF bias of 300 watts. There was no noticeable decrease in clamping force.

·      Will not scratch glass

Applications:

·        Solar cell manufacturing (glass substrates)

·        LED’s (sapphire and GaAs substrates)

·        Dielectric substrates having a dielectric constant > 5  

·        Semiconductor manufacturers  

As a custom supplier to the semiconductor industry we can modify your system to accept the new chuck assembly, and supply a turnkey solution to your clamping needs.

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