BWGTC
is pleased to introduce an electrostatic clamping solution for glass
and dielectric substrates in a high
vacuum processing chamber for deposition and etch processes.
· This chuck plugs into a modified
base assembly that accepts a Lam Research 718-092326-061 electrostatic chuck.
· BWGTC has successfully clamped
· The initial design is for a 6”
major flat type substrate and these results are scalable for 100, 200, and 300mm
clamping.
· The clamp can be redesigned to fit
other manufacturers tool sets e.g.
· The holding force results are
applicable to other dielectric materials. In this case we have demonstrated
clamping of a substrate with a dielectric constant > 5.
Features:
· Bipolar operation +/- 2000
· Fast clamp and release times
· Backside gas can be introduced 3
seconds after full voltage is reached on the device (fast clamp)
· Holding force is specified at >
20 Torr of backside pressure at 4000 volts. We do not recommend running the
backside gas at 20 Torr.
· Release of the substrate (dechucking)
occurs within 3 seconds of the
· The structure has successfully held
a glass substrate with 20 Torr of backside gas pressure and a RF bias of 300
watts. There was no noticeable decrease in clamping force.
· Will not scratch glass
Applications:
·
Solar cell manufacturing (glass
substrates)
·
LED’s (sapphire and GaAs
substrates)
·
Dielectric substrates having a
dielectric constant > 5
·
Semiconductor
manufacturers
As a custom supplier to
the semiconductor industry we can modify your system to accept the new chuck
assembly, and supply a turnkey solution to your clamping needs.
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