If you wish to be on our mailing list please send an e-mail to the address below.

Please send any questions or comments via e-mail to marketing@bwgtc.com

This site was updated on 01-04-2008

Description of services identified above:

The "business information" page contains contact information, directions and other company related information.

The "capabilities statement" page lists our qualifications and services offered.

The "custom programming " page lists some examples of the programs we have completed. 

The "electrical design and analysis" page lists services we offer relative to electrical testing and development.

The "electrostatic clamping" page contains links to numerous pictures, product descriptions, electrostatic theory, and other pertinent clamping information.

The "material research" page lists some of our capabilities and shows some examples of the testing we provide.

The "news" page highlights activities in the semiconductor industry and at BW Global Tech Corp. This page is used to introduce new products.

The "project and program management" page lists projects and programs we have performed for other companies.

The "services" page lists the areas we are targeting for continued business. This is a broad listing so please call regarding your specific requirements.

The "system design services" page lists specific project areas we have successfully completed for our customers.

The "technical articles" pages contain information on troubleshooting, theory of operation, and other requested customer information.

The "thermal design and analysis" page lists activities we have performed for thermal diagnostics and material characterization.

The "wanted" page lists equipment, assemblies, and parts we have an immediate need for.

Keywords: circuit modeling and design, consulting, contracting, design, design of experiments, DOE, electric field modeling, electrostatic chuck, electro static chuck, electro-static chuck, electrical design and analysis, electrostatic clamping, electrostatic modeling, ESC, etch, fab startup, finite element analysis, FEA, machine matching, material characterization, Microsoft project software, project management, Labview programming, program management, RF circuit design, RF delivery systems, RF measurements, statistical analysis, system design, thermal design and analysis, thermal modeling